Germanium wafers have semiconductor properties.It plays an important role in the development of solid physics and solid electronics.Ge melt density of 5.32 g/cm 3, germanium possibility as scare metal, germanium stable chemical properties, temperature not with air or water vapor, but during 600 ~ 700 ℃, germanium dioxide generated quickly.With hydrochloric acid, dilute sulfuric acid has no effect.When concentrated su

A processing method for ultra-thin single-crystal germanium wafers is characterized by the following steps: first, single crystal germanium wafers with a thickness of less than 0.5 mm are cut from the single crystal germanium rods using a linear cutting equipment;Secondly, the single crystal germanium chip is loaded into the low temperature polishing machine.Third, first use diamond, corundum, silicon carbide, boron